Senior PCB Design Engineer (Dublin or Gdynia)

Company Description

Benetel has been providing LTE Platforms for the Telecommunications market specifically targeting wireless infrastructure. Our leading edge modules are used by our clients in their Cellular Base Stations, predominantly small cells. The multi-disciplinary team members are experts in Wireless Standards, Embedded Software, DSP, RF Design, Digital, Mechanical and Test System design.
In 2018, we have embarked on a strategic initiative to provide Remote Radio Units (RRU) for CloudRAN networks of the future.

Our internal capabilities cover all phases of product development from System Architecture, Design, and Conformance Testing to Automated Test Systems to support high volume product manufacturing. Our innovative product development approach has contributed several world firsts in low-power and cellular small cell product development. We work closely with major semiconductor and software companies and are committed to delivering the very latest technology products to our global customer base.

Job Description

Benetel is recruiting a Senior PCB Design Engineer to be located either in Dublin, or in our new development location in Gydnia, Poland. This role will report to the Engineering Manager and is a key member of the development organisation. The main purpose of the role is to design Printed Circuit Boards (PCBs) for radio frequency (RF), high speed digital and mixed signal circuits. Additional responsibilities include the development and maintenance of the PCB CAD component libraries.

The role can be based in either our headquarter in Dublin or our new development location in the Tricity metropolitan area in Poland.


Desired Skills and Expertise

Educational and Experience Requirements

A Bachelor’s Degree in Electronic or Computer Engineering or other relevant discipline and relevant experience is required. Position and salary commensurate with experience

It is expected that candidates for the Senior PBC Design Engineer role will have demonstrated some or all of the following:

  • Demonstrated experience of schematic capture and PCB layout using one of the leading CAD packages (Altium preferred).
  • Demonstrated ability to design multi-layered PCBs using industry standard techniques.
  • Ability to technically liaise with engineers and external suppliers.
  • Previous experience working on RF products or High-Speed digital would be beneficial.
  • Ability to work to tight deadlines and multi-task across a variety of responsibilities
  • Knowledge of DFM & DFT approaches